Description: Leveraging Technology for a Sustainable World Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). Proceedings of the 19th CIRP Conference on Life Cycle Engineering, University of California at Berkeley, Berkeley, USA, May 23 - 25, 2012 Author(s): David A. Dornfeld, Barbara S. Linke Format: Paperback Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Germany Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K ISBN-13: 9783642438134, 978-3642438134 Synopsis The 19th CIRP Conference on Life Cycle Engineering continues a strong tradition of scientific meetings in the areas of sustainability and engineering within the community of the International Academy for Production Engineering (CIRP). The focus of the conference is to review and discuss the current developments, technology improvements, and future research directions that will allow engineers to help create green businesses and industries that are both socially responsible and economically successful. The symposium covers a variety of relevant topics within life cycle engineering including Businesses and Organizations, Case Studies, End of Life Management, Life Cycle Design, Machine Tool Technologies for Sustainability, Manufacturing Processes, Manufacturing Systems, Methods and Tools for Sustainability, Social Sustainability, and Supply Chain Management.
Price: 197.88 GBP
Location: Aldershot
End Time: 2025-01-29T09:15:17.000Z
Shipping Cost: 54.09 GBP
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Book Title: Leveraging Technology for a Sustainable World
Number of Pages: 625 Pages
Publication Name: Leveraging Technology for a Sustainable World: Proceedings of the 19th CIRP Conference on Life Cycle Engineering, University of California at Berkeley, Berkeley, USA, May 23 - 25, 2012
Language: English
Publisher: Springer-Verlag Berlin AND Heidelberg Gmbh & Co. KG
Item Height: 279 mm
Subject: Engineering & Technology, Management
Publication Year: 2014
Type: Textbook
Item Weight: 1597 g
Subject Area: Educational Technology, Mechanical Engineering
Author: Barbara S. Linke, David A. Dornfeld
Item Width: 210 mm
Format: Paperback
